Jushi CSEAC 2026 | Yiwen Technology successfully concludes, building a new ecosystem for the semiconductor industry with hardcore equipment

Time：2026/09/02

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Recently, the 14th Semiconductor Equipment Materials and Core Components Exhibition (CSEAC 2026) successfully concluded ...

Unite for Domestic Chips | The 14th CSEAC Opens Today, with Yiwentech at Booth 39, Hall A1, Awaiting Your Visit to Explore Innovative Solutions

Time：2026/08/31

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Today (August 31), the 14th Semiconductor Equipment Materials and Core Components Exhibition (CSEAC 2026) officially ope...

Process Case | Yiwen Technology CCP SiC Trench Etching Process

Time：2026/08/27

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In the semiconductor manufacturing process, the performance of traditional planar SiC MOSFETs has approached the theoret...

Xinju Wuxi | Yiwen Technology invites you to meet at CSEAC2026 to explore new opportunities for equipment localization

Time：2026/08/05

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The 14th Semiconductor Equipment Materials and Core Components Exhibition (CSEAC2026) is about to kick off. As an annual...

Process Case | Yiwen Technology ICP 100 μ m GaAs Deep Etching Process

Time：2026/05/15

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In the manufacturing of VCSEL chips, optical communication devices, and microwave RF devices, deep etching of GaAs (gall...