Process Case | AMTE SINO Plasma 6000 ICP SiC trench etching bottom corner and sidewall roughness optimization development

Time：2025/04/17

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Silicon carbide (SiC), as a representative of third-generation semiconductor materials, has become the core material for...

SEMICON CHINA 2025 has come to a successful conclusion! AMTE and You Go to the New Future of Semiconductor Front End Equipment Together

Time：2025/03/28

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From March 26th to 28th, 2025, the globally renowned SEMICON CHINA exhibition in the semiconductor industry came to an e...

AMTE shines on the first day of SEMICON China 2025! Domestic semiconductor front-end equipment breaks through again, empowering semiconductor "chips" for the future

Time：2025/03/26

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On March 26th, the annual global semiconductor industry event SEMICON China 2025 grandly kicked off at the Shanghai New ...

Exhibition Preview | See you in Shanghai! AMTE cordially invites you to attend SEMICON CHINA 2025!

Time：2025/03/05

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From March 26th to March 28th, SEMICON China 2025 Shanghai International Semiconductor Exhibition will grandly open at t...

Process Case | AMTE Technology SINO Plasma 8000 PVD Hot Al Filling Development

Time：2025/02/26

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The PVD (Physical Vapor Deposition) hot Al (aluminum) filling development experiment is a process study for depositing a...